TBPG

TBPG series modular terminal blocks for conductor thicknesses from 0.08 mm2 to 16 mm2 are the ideal choice for grounding applications. They consist of a solid PA 6.6 body equipped with a practical universal DIN rail attachment system. The push-in technology applied to the docking base design allows the individual terminals to be conveniently mounted and dismounted along the DIN rail as quickly and conveniently as possible, minimizing work time. Available in yellow/green, the push-in clamps have cone-shaped entry holes to facilitate the introduction of conductors into the terminal housings, which are made with CRCA plates to ensure a stable and effective connection.